Electronics Forum | Mon May 07 10:42:09 EDT 2012 | saju86ece
Hi, I need one clarification about solder paste printing height tolerance. How to define and fix the solder paste height tolerance after screen printing for inspection purpose. Currently we are using 5mils thickness of stencil, in that we are gave
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Wed Jun 07 22:33:50 EDT 2006 | Bolos
first: what is your problem after reflow? second: a good rule of thumb is a tolerance of 1 mil. for example..if you got 5 thou stencil thickness then your range of thickness is 6-/+1 thou.. then you just improve after you get your height data and ana
Electronics Forum | Tue Jan 07 23:38:08 EST 2014 | m_imtiaz
want to know the tolerance the paste height in the solder paste printing. for example if stencil thickness is 7 mil, what will the acceptance level of paste height ( upper and lower) kindly share if any guidelines or formula for the same
Electronics Forum | Tue May 30 16:02:04 EDT 2006 | slthomas
Do a dirty DoE...print ten boards with the worst error you think you can accept, build them up, and count print related defects. At the same time, print ten spot-on and proceed the same. If you don't have any more defects on the off-print batch show
Electronics Forum | Thu May 25 18:32:12 EDT 2006 | pms
Having an issue with our paste inspector (human type). Were printing paste on .5mm pitch pads (MLF package). My question is - What is the acceptable print deviation (percentage) off the pad before you see problems after reflow? 0%? 1%? 10%? 25%?
Electronics Forum | Fri May 26 08:16:14 EDT 2006 | Chunks
This could be what we call a "non-problem". If your print is off slightly, yet after reflow there is no solder related defects, it should be considered OK. Move your inspector from the printer to right after the oven. This would enable them to ins
Electronics Forum | Fri May 26 11:06:49 EDT 2006 | pms
Chunks, ROTFLMAO !!!!!!
Electronics Forum | Fri May 26 09:49:34 EDT 2006 | pjc
This question cannot really be answered definitively here. There are unknowns such as your board design and solder land finish. I suggest you conduct a DoE (Design of Experiments) to determine paste print deposition X-Y-Theta tolerance for your appli
Electronics Forum | Fri May 26 10:04:06 EDT 2006 | jdengler
Paul, The paste you use is another variable. As Pete recommends to know the real answer you need a DoE. Jerry