Electronics Forum: print off (Page 9 of 66)

Solder Splash

Electronics Forum | Wed Jun 18 09:13:44 EDT 2008 | realchunks

You're barking up the wrong tree. Solder "splashes" are generally caused by your print being off pad a bit. They are called solder fines. I've never seen a placement machine have the capability to push paste around using it's kiss-off from the noz

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Thu Jan 29 18:32:20 EST 1998 | Rin Or

| Using metal squeegees on GSPs has caused premature stencil wear. Has | anyone had any success with this combination? How much snap off did you | use? We are using .5 mm pitch and have a no clean process. I have been using lots of metal sqyeegee

Printing forum items

Electronics Forum | Fri Dec 03 12:45:28 EST 1999 | Bill

I'd like to print out a forum item to fax to a friend who does not have internet access or email yet at his new facility, but no matter what I do to my printer set-up I cannot get the full page width to print. The right side of the message keeps gett

Indium NC-SMQ92J paste problems

Electronics Forum | Fri Apr 23 11:42:30 EDT 2004 | patrickbruneel

Thanks for the answer. what i believe happent is that the manufacturer of the paste reduced the tackiness of the paste to eliminate the squeegee sticking problem, and now with the reduced tack its a lot easier for the powder particles to break off du

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 11:08:20 EDT 2000 | Fraser

Dave, Why on earth would you want to use a stepped glue stencil?. If you print slightly off contact the hight of your glue deposition will be roughly half the width of your adhesive aperture width so if you want a 10mil high deposit use a 20 mil ape

Pad Sizes

Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler

I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.

Solder paste height checking

Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS

We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of

Barcodes for PCBs - what systems?

Electronics Forum | Fri Jun 13 08:49:19 EDT 2008 | leemeyer

We use Zebra printers 170xii. If you buy used you can get them for a relatively low cost ( couple hundred $$). You will need to find software to work with the printer. We use Bar One. Brady Labels supplies a full line of thermal printable labels & ri

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 07:37:13 EDT 2006 | Chunks

Hi Umar, I believe you either are over printing these pads or the alignment of board and stencil may be off. Check your print right after your screen printer to verify either. If you are not over printing and your paste alignment is spot on, then

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 21:07:00 EDT 1999 | Deon Nungaray

| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar


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