Electronics Forum | Wed May 03 21:07:36 EDT 2000 | Eric Chua
Hi Steve, I had face problem before. What I did, add addition process which is screen print that apply adhesive. During thru-hole assemble, the components hold strong by the solder. Try this.
Electronics Forum | Wed Apr 19 22:33:49 EDT 2000 | Dave F
Wister: Those are neat results!!! What results do you get if you use different squeegee speeds with your viscosity DOE? With high viscosity and the print speed you're using the roll may be "skipping over" the apertures. Wadda loose? Dave F
Electronics Forum | Thu Apr 20 14:19:46 EDT 2000 | Joanne DeBlis
Hi Paul, Another method of achieving a planar surface is PPT. This may alleviate the problem your having. For additional information you can visit our web site at masktek.com. Joanne DeBlis
Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson
Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed
Electronics Forum | Mon Jan 22 22:37:27 EST 2001 | davef
50 ppm oxygen was on half joints reflowed in air. 3d Human factors PCB pad cleanliness: Handling of bare board pads creates excessive voiding. Print rejection: Cleaning of OSP pads with acetone or isopropanol increases voiding.
Electronics Forum | Tue Jan 30 10:19:20 EST 2001 | ibi
I think that tolerance of pcb thickness is described in the �1-2-4 of IPC41-01 (Specification for Base Materials for Rigid and Multilayer Printed Boards Supercedes IPC-L-108, L-109, L-112, L-115, AM-361). Good reading,
Electronics Forum | Sat Feb 10 18:33:52 EST 2001 | arturoflores
check the archives (keyword="16 mil pitch") and also consider 45 degree pattern printing. Regards.
Electronics Forum | Mon Feb 19 18:40:43 EST 2001 | davef
Please take us through the options for processing the "waste" liquid that is loaded with solder, adhesives, and what not as a result of cleaning stencils and mis-printed boards. What are the costs for equipment, material disposal, and other items of
Electronics Forum | Thu Mar 15 07:49:44 EST 2001 | jax
I am not sure if it is feasible in your situation becuase I don't know enough about your board ( mixed technology, single-sided, etc.... ) , but have you ever considered screen printing paste onto the test points?? JAX
Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman
We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.
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