Electronics Forum: printing (Page 295 of 483)

Re: PCB panellisation

Electronics Forum | Fri Apr 03 14:09:50 EST 1998 | Chrys

I'm also in the "Don't score it" camp. Routed breakaways are much better. If your wave solder process has decent control on the wave height, you shouldn't worry about flooding the boards. The fine pitch consideration for panelizing - Since you norm

Re: reflowing through hole components

Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper

Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 10:43:32 EST 1998 | Alan Pestell

We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. 1) Do you need to

Re: Printer troubleshooting

Electronics Forum | Wed Mar 11 17:20:25 EST 1998 | Tim Quesenberry

| Does anyone know of a web page that provides troubleshooting techniques for the printing process? We aren't experiencing a problem right know but are attempting to set up a reference guide for training. Any help would be greatly appreciated. | Than

Re: Stencil Opening

Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach

| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Thu Jan 29 18:32:20 EST 1998 | Rin Or

| Using metal squeegees on GSPs has caused premature stencil wear. Has | anyone had any success with this combination? How much snap off did you | use? We are using .5 mm pitch and have a no clean process. I have been using lots of metal sqyeegee

B.I.C. SMT Process Controls

Electronics Forum | Tue Aug 07 20:51:43 EDT 2001 | davef

Sowaza BIC? Ru the ball point pen people? Know no sites, like thet, but let�s see what we can do here. Wedabomb. First, rather than defining the controls your suppliers must use to produce your product, why not specify a DPMO rate er suppin like t

B.I.C. SMT Process Controls

Electronics Forum | Wed Aug 08 21:31:31 EDT 2001 | davef

OK, so yer stuck wid dees sembly guys, yer bosses are moroons wid pointy heads, and you gotta fix it. snafu. Paste printing: Measure shape, height, volume, area, registration, and paste bridging. Inspect/control solder paste deposits for fine pitc

MPM Print Parameters

Electronics Forum | Thu Aug 16 12:07:29 EDT 2001 | Hussman

Why would you have a stencil made without knowing the capabilities of your equipment?!!? Ok, the manager in me has spoken, you can cut a few hundred bucks off a stencil by putting two on one, but the reply Michael has posted brings up many other iss

Solder Joint Strength on Fine Pitch

Electronics Forum | Wed Aug 15 21:56:53 EDT 2001 | hardy boy

Our R&D Guys used to push the lead of a fine pitch component using a Pick or a thin metal tip and if the lead snapped off from the land it's considered failed. Is that the proper way of identifying the solder joint strength? We got problems with sold


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