Electronics Forum | Fri Aug 17 15:59:02 EDT 2007 | mika
A quick guide... But let me tell you the essentials in the beginning/middle of next week (I will then copy "our way"). There are 3 consecutive steps of how to proceed. Maybe I can e-mail you this in a word doc, where I can put in screen shots? I don'
Electronics Forum | Fri Aug 17 05:58:29 EDT 2007 | dilogic
Hi, your machine is exactly the same configuration as mine. I even think we both bought them from the same seller ;-). Anyway, it's BLOCK-I with (most probably) USOS V1.4.14 software running on OS/2. I've registered the software with UIC for 400 E
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Tue Dec 23 14:45:06 EST 2008 | comatose
One thing that helps is to divide large pads into a series of smaller pads. This prevents the scooping you're talking about.
Electronics Forum | Wed Dec 24 20:11:43 EST 2008 | xianhua_tang
hi,brettc! Our stencil openings no more than 4mm * 4mm, you have a larger component of the pads is more than a 4*4? At the same time, with the thickness of the stencil, I would like to increase the printing speed can be improved to reduce the thickne
Electronics Forum | Wed Feb 24 03:49:08 EST 2021 | bangir
Hello Dear... I am looking for Manual Book/Part List for Solder Print Inspection DJTECH BPC707ADX. Please share me the manual book.. Thanks, BangIr
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Tue Dec 23 15:06:25 EST 2008 | evtimov
It depends how manual is the printer. you need to control pressure and speed. If you control both by hand, it is difficult to discuss results. If the pressure is controlled by the printer, than you should be able to do it by one deposit. Also is the
Electronics Forum | Mon Oct 14 14:35:51 EDT 2013 | garym4569
Thanks for the replies. I have just ordered the IPC Stencil Design Guidelines manual.
Electronics Forum | Sun Feb 24 19:10:17 EST 2008 | larryd
Skill and experiance level of assemblers is critical. High skill and experiance with the type of assembly, print and BOM and hgihlighters. Day labor would be 5 to 10 components for each assembler, already prepped with pictures or drawings showing wh
