Electronics Forum | Tue Apr 27 18:43:29 EDT 2021 | reem1993
Hi, I encounter the phenomenon of Solder Ball on pads after printing useing DEK, is someone encounter the same problem? How may i fix it? best regards,
Electronics Forum | Fri Apr 30 19:22:57 EDT 2021 | compit
After printing or after the oven? Too much paste - thinner stencil, smaller holes, to rare paste ...
Electronics Forum | Wed May 05 06:30:40 EDT 2021 | jineshjpr
Do Proper underneath stencil cleaning. if the cleaning not effective, check Vaccuum section of the printer machine. Else change the Wipe roll. Trying out with other cleaning solvent (dedicated to stencil cleaner) also improve this issues.
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ
Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ
Electronics Forum | Sun Sep 12 08:30:29 EDT 2004 | davef
Well, another alternative is to use a water washable flux. If you insist on staying with a NC flux, use one that is probable. We prefer to probe solder, rather than copper.
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