Electronics Forum | Mon Feb 10 16:59:57 EST 2014 | hegemon
It is sort of a self answering question if you come in from the solder paste angle. First....start gathering data. Check every day, or every new paste jar, for: Storage conditions (temp), paste expiration date, ambient temp and humidity where yo
Electronics Forum | Wed Mar 21 19:01:33 EDT 2007 | dekhead
If you MUST double print, probably to get good aperture fill near board edges, I would recommend letting off on pressure (maybe 20%) to minimize the bleed. Alot depends on your board (gasket) quality.
Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1
Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Tue Mar 18 14:00:25 EDT 2008 | rrpowers
There are 2 reasons for wanting to change to an enclosed print system: - Reduce solder paste usage. (We run a high volume application so any reduction in paste scrap is a big money saver to our company.) - Improved print quality. (Ours is a non-rew
Electronics Forum | Mon Apr 07 15:40:05 EDT 2008 | pjc
Pump print heads do not print better. Blades print faster and better quality than pump print heads.
Electronics Forum | Tue Sep 19 09:41:30 EDT 2017 | sumote
Steve, The 4 things I would do, and in this order: 1. Clean your stencil with stencil cleaner wipes after it comes out of the stencil cleaner. I like MicroCare ProClean (MCC-PROWR). I will even saturate the wipe with a bit of isopropal just till
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Thu Sep 07 11:39:39 EDT 2017 | swag
Two magic bullets help us greatly with fine pitch printing: 1) nano coatings (we use a DEK product) YES it really does work 2) temperature control in the printer (AC unit). Of course good quality stencil and proper cleaning of the stencil are im
Electronics Forum | Fri Nov 28 04:16:33 EST 2003 | stoney_tsai
Hi, all, I have done an analysis through Statistics on solder volume whose purpose is to identify the required volume for different pitch printing (0.65 or above, 0.50, and 0.40 mm). Finally, came out a regression model. But, I need to evalua
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