Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Mon Jun 21 08:01:38 EDT 2010 | jm
Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Wed Mar 24 17:09:34 EDT 2010 | davef
RE Search: Search can be tricky. Try MSD and wash
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL
Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Mon May 08 08:54:28 EDT 2000 | Lee Radney
Ok... Anybody got any quick, low cost ideas that can help me here? We run various panel layouts (all products are same width) thru our reflow oven. The problem is that due to the different layouts of our panels, the moveable center support chain
Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
Electronics Forum | Wed May 08 09:40:33 EDT 2002 | Hussman69
One thing most over look is the time between the last reflow and the second print. You don't want to print on a hot board.
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