Electronics Forum | Thu Jan 09 06:35:14 EST 2003 | mk
Consider ssd. Eliminate paste application. No printing necessary. www.sipad.net mk
Electronics Forum | Thu Jan 16 09:44:55 EST 2003 | Evtimov
hi, I have experience in placing BGA's with this pitch and it's OK.Tell me more about your problem(printing ,placing, accuracy rotation) or whatever ti is.
Electronics Forum | Tue Jan 07 15:14:25 EST 2003 | russ
What exactly are you concerned about? This is from what I can see a pretty standard part (30 mil pitch, 17mil ball). Sorry, I have to convert to inches for my weak brain to work! This part should process very well. Russ
Electronics Forum | Wed Jan 08 10:54:19 EST 2003 | dphilbrick
As Russ says this should process well the BIG BUT..T is what are you using to process this part! How old / capable is your equipment. Screen print quality is a must. Placement accuracy is critical and reflow stability is important. So the answer is d
Electronics Forum | Tue Jan 07 15:03:25 EST 2003 | ksfacinelli
I have a client interested in using a Toshiba Part P-TFBGA48-0607-0-0.75AZ. Mechanical data on the part can be found at: http://www.toshiba.com/taec/components/Datasheet/51WHM516AXBN.pdf I am concerned with being able to use this part with consist
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
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