Electronics Forum: process characterization (Page 1 of 8)

Wavesolder process characterization

Electronics Forum | Thu Jan 29 12:47:53 EST 1998 | Henry Lee

I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and double-sided boards. Can anyone po

Re: Wavesolder process characterization

Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon

| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Flux dip or solder print for CSP

Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining

Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure

Blowholes during wave soldering

Electronics Forum | Tue Sep 11 15:08:11 EDT 2007 | shrek

KRIKIES! If that wasn't a sales pitch, I don't know whut was, me lad. Optimizer is good for DoE's and process characterization, but no substitute for the artform that is wave soldering. When me lads here in Purchasing get PCB's from all over the w

Re: Process Characterisation

Electronics Forum | Sat Dec 02 21:21:11 EST 2000 | Murad Kurwa

Our NPI division is in a same category. We assemble small quantities and lot of different set-ups. I created a DPMO charting method using Excel that we use at Post Reflow, Post Wave and Final QC. In addition, we use x-r charts at screen print for con

Wavesoldering capability study

Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir

Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process

SPC for Wave solder (defects on PCB's)

Electronics Forum | Tue Feb 07 11:26:40 EST 2006 | Cal Kolokoy

At the wave, you should collect data on the critical process parameters. The cliche being, it's better to control your process via SPC versus performing SPC on defect data. Perform a DoE to determine which variable interactions have the greatest eff

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

SPC for Wave solder (defects on PCB's)

Electronics Forum | Mon Feb 13 16:24:39 EST 2006 | samir

SPC was a fad of the '80's and has been mis-used by the igonorant for decades now! Doing SPC on defects is a case in point. Hell I implemented wave SPC programs before eating breakfast at 2 previous companies, and they worked great..resulting in 25

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