Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon
| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any
Electronics Forum | Thu Oct 18 11:20:21 EDT 2001 | davef
Ooooo, you do have the toys, baybeee!!!! This really is not a good situation. * Leaving this OA flux res on your boards will surely affect the LT performance of your product. * That a rookie found this by noticing solder balls all over the seconda
Electronics Forum | Mon Apr 17 19:46:39 EDT 2000 | Dave F
Murad: Your customer is smart to be concerned about the affect of changing production processes on product reliability. Your Company is smart to inform customers and keep them in the loop about these changes. In developing your demonstration of th
Electronics Forum | Fri Apr 10 10:04:44 EDT 1998 | justin medernach
| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w
Electronics Forum | Thu Jun 14 15:29:29 EDT 2012 | davef
That you can get good solder flow when hand soldering seems to indicate that the temperature of your solder pot is too low. Still, I'm uneasy that you see gold on the pads after passing the board across the solder pot. Gold is so thin with ENIG. So
Electronics Forum | Mon Apr 13 07:55:48 EDT 1998 | justin medernach
Dear Justin, I am not asking for experiences with ovens as to whether you think they are capable of THT reflow. I am asking more specifically about actual req's and experiences with THT reflow, regardless of the oven used. Your answer does not hold i
Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan
| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R
Electronics Forum | Mon May 26 03:27:00 EDT 2014 | julianf
Thanks for your reply Sarason. I'm aware now that my goals seem very ambitious and infeasible. Let me formulate my problem in an different way that might be more realistic. Is it possible to measure a DIFFERENCE in strain between top and middle la
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