Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson
Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe
Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas
Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s
Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie
We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp
Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi
That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,
Electronics Forum | Thu Jul 17 12:19:51 EDT 2008 | realchunks
6 mil 100% on pad print. No shorts.
Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto
If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci
Electronics Forum | Mon Mar 03 08:16:00 EST 2003 | martys
We are using MPM and DEK printers, what are the critical variables for measuring print process capability?
Electronics Forum | Wed Mar 07 12:25:49 EST 2007 | Pete
Looking for a reliable solution to printing and applying bar codes to pc boards for manufacturing processing and traceability
