Electronics Forum | Wed Aug 07 11:55:31 EDT 2002 | slthomas
Ron, have a look at http://www.fda.gov/cdrh/dsma/cgmphome.html It would be a nightmare, if your plant is not structured to support it. It's a huge pain in the fanny even when you (alledgedly) are. I'm not sure what you're pursuing, but if you're c
Electronics Forum | Wed Feb 22 12:19:49 EST 2006 | Dirka Jihabi
I worked for a EMS who makes Medical Device Electronics, and yeah, the FDA's methodology for validation is a complete cluster-fudge! They did it on the principle of...does the shop air going into your equipment REALLY 80 PSI...or is there REALLY 220
Electronics Forum | Wed Feb 22 20:11:59 EST 2006 | slthomas
*Qualify* your equipment by running X boards, Y times, through each piece of equipment under normal operating conditions and quantifying the performance, as in a ppm rating. Then validate your process by defining all of the steps you use to generate
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Oct 12 11:18:57 EDT 2012 | srgbarba
Hi, I want to ask if someone saw the combo process at smt lines for panel array (bot & top per both sides), I just perform some experiments and it works perfectly, and I validate the T hus (Cg/Pa) and no one component were dropped after the 2nd reflo
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Mon Mar 29 14:58:08 EST 2004 | davef
Josh: Final cure of the LPI solder mask: 310*F for 45 minutes. Your board fabricator needs to do a better job. Most fabs do not check cure, because the processes subsequent to cure are so brutal that the fab expects the following process to highlig
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
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