Electronics Forum: process visuals (Page 1 of 26)

BGA process

Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks

BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g

CAD2CAD Panelizing process

Electronics Forum | Wed Aug 19 16:58:32 EDT 2020 | kumarb

Hi. We appear to have a basic grip on using the CAD2CAD tool v1.5 from Assembleon for our PCB designs. Can anyone offer advice on how to take our PCB design and allow us to panelize the single PCB to say 2-up or 4-up, etc. So that we can visualize th

seeking better process

Electronics Forum | Fri Mar 16 16:58:52 EST 2001 | davef

A most evocative title to the tread, Ed. Few companies in Joysee named "C-Tech", eh? I assume we�re talking "C TECH is a distributor of low vision aids and adaptive technology for the blind, visually impaired and learning disabled." [http://www.lowv

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

Clean vs No Clean PCB assembly process

Electronics Forum | Wed Jul 25 10:46:36 EDT 2001 | Steve

Most of the problems that you will find with NC is visual. I have not found or heard of any real evidence that NC causes component or board failures. The residue has extremely high resistance, which actually gets higher as time goes on. It's a paradi

Flux residues found after assembly process (Clean process)

Electronics Forum | Sat Jan 09 01:30:36 EST 2016 | junax

Thanks for your input Michael. Basically the boards had been go through from washing and even ionic contamination already. In order to eliminate or detect the flux residues, is there any equipment something like a uv lamp that can detect the flux fro

Flux residues found after assembly process (Clean process)

Electronics Forum | Fri Jan 08 12:27:55 EST 2016 | aqueous

The most common method is a R.O.S.E tester. They have been around for 30 years and are an industry standard for ionic contamination (flux and other residues) testing. Manufacturers include: Zero Ion www.aqueoustech.com Omegameter / Ionagraph http:/

Flux residues found after assembly process (Clean process)

Electronics Forum | Wed Jan 13 12:17:47 EST 2016 | trampacorp

Thanks for your input Michael. Basically the > boards had been go through from washing and even > ionic contamination already. In order to > eliminate or detect the flux residues, is there > any equipment something like a uv lamp that can > dete

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf

I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

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