Electronics Forum: processing osp fabs (Page 1 of 52)

osp

Electronics Forum | Wed Dec 20 15:21:06 EST 2000 | OS

How should OSP PCB be handled, when stored; and during manufactruing process on production floor?

Re: N-tech osp problems

Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F

Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst

N-tech osp problems

Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg

I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this

secondary processing of BGAs

Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef

Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using

What problems will be encountered in subsequent PCB processing

Electronics Forum | Thu Jul 26 09:14:17 EDT 2018 | teresat2

When the PCB is finished, it must be mainly tested. Mark the broken plate of the short-circuit broken wire, or SMT may fix you later. In the case of Mosaic, the same location of the bad packaging together. Next is SMT welding commonly, want to look f

PCB manufacture

Electronics Forum | Tue Aug 20 19:15:39 EDT 2002 | stownsend

On a gold plated PCB, when in the PCB fab process is the gold plating applied? How about OSP, when in the process is OSP applied?

PCB Acceptance Standards

Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal

IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA

Chosing ENIG vs OSP

Electronics Forum | Thu May 28 22:17:18 EDT 2009 | davef

If your fabricator understands and controls their in-house ENIG, you should be OK. It seems that fabs don't undererstand ENIG processes well enough to duplicate hyper-corroded nickel, but those that have not seen the defect usually never see it.

Re: Solid Solder Deposits

Electronics Forum | Wed Jul 29 20:53:44 EDT 1998 | Dave F

| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on ho

Info on OSP PCB�s

Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef

You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t

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