Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef
Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and
Electronics Forum | Thu Dec 09 10:40:45 EST 2010 | grahamcooper22
MSL 3 means you can have the devices open for a maximum of 168 hours in an atmosphere of less then or equal to 30 C and 60% RH. If the humidity is less then 60% then it means the devices will absorb less moisture in a given time, but even at 40% RH y
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika
Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h
Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F
| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Fri Feb 23 03:13:21 EST 2007 | vshan
if No FMI is that every cycle we have to press confirm, if yes it will effect during production mode rgd vshan
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Wed Oct 16 09:55:24 EDT 2013 | markhoch
Thanks guys. I can see the benefit as a CM, when you have no control over the Parts/PCBs that come in the back door. In my previous job at a CM I did often have product coming in the back door that did appear to have exceeded its shelf life, and hav
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