Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Mon Feb 27 13:02:13 EST 2006 | masrimhd
Hi, Thank you for your answers. But I want to explain some points on which I would appreciate any comment: * Having calibrated the process, we intend to carry out the ROSE test just on SAMPLES of the finished boards. Lets say one every hour. I exp
Electronics Forum | Thu Oct 21 09:56:11 EDT 1999 | Brian
Rich An excellent question and one which is often totally ignored. If you wish a "no-clean" flux to be as safe as it possibly can be, the PCB and the components must all be contamination free (ionic and non-ionic). Only then can you be sure that the
Electronics Forum | Wed Aug 10 04:15:01 EDT 2005 | vinitverma
Ari, I would suggest you make a checklist of all your requirements (not just large scale production) and prioritize them with weights assigned to each. Fill in the checklist for each equipment and manufacturer and you'll have the results out. I wou
Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Thu Jun 12 04:22:00 EDT 2003 | gaoliangcheng
Hi, our factory is introducing the FPC process. I have some question to ask.Could anyone reply/ 1.how can we fix the FPC in the mounting and printing process? 2.how can we set up the temperature profile? Thanks.
Electronics Forum | Sat Jun 14 17:08:35 EDT 2003 | MA/NY DDave
Hi I don't see any answers so let me ask a question so even if I don't pop back in others will do their best. Is FPC (Flexible Printed Circuit) or is it something else. I only know cause I have been into that flexible circuits. YiEngr, MA/NY DDav
Electronics Forum | Sat Oct 19 04:24:56 EDT 2019 | SMTA-Davandran
There is double sided adhesive that able to withstand high temperature during reflow. `keep the adhesive minimum and appropriate location for securing the FPC on pallet during entire SMT process and easier for release of FPC after reflow process. Tak
Electronics Forum | Mon Mar 21 10:40:33 EST 2005 | emeto
Hello all, Can you tell me what standart is used for communication between machines in production line. I don't mean SMEMA. There is a standart for machine communication, they can communicate one with another. That is the way for example AOI says th
Electronics Forum | Tue Mar 22 06:03:55 EST 2005 | Base
Try the IPC-254x CAMX standards (webstds.ipc.org, no www prefix!). They define a set of generic and process-specific XML messages for equipment to send out all sorts of process-related events. I know there are standardized messages for print, dispens
