Electronics Forum: profil (Page 210 of 462)

Question on BGA Solderability

Electronics Forum | Tue Jul 24 14:00:08 EDT 2001 | Steve Schrader

Greg, Yes, I did my tour of duty. Is your boss back from Bermuda yet? If so, tell her to check her email! Thanks. BTW, there could be a benefit to moving parts, but that would be dictated by your ability/inability to achieve a proper reflow prof

Wave rider

Electronics Forum | Thu Aug 02 12:43:14 EDT 2001 | nwyatt

Wave rider is an oven profiler made by ECD. http://www.ecd.com. They are commonly known for their MOLE. The wave rider is different from the MOLE because it is used to measure the temperature, conveyor speed, etc. of the OVEN instead of the pcb.

BGA .75mm Real World Experience

Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho

I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc

Unsoldered Component

Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor

We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej

Unsoldered Component

Electronics Forum | Wed Aug 01 10:28:24 EDT 2001 | btaylor

We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej

Defects Definition

Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG

Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination

Re: Solder balls after wave soldering

Electronics Forum | Sun Jan 30 03:06:50 EST 2000 | Roni H.

Hi, The major reason is that the flux is still "wet", you should fix the temp. profile (specialy preheat zone) so the evaporation of flux carriers will be better (anyway not to much !). Recommended: 1st preheat zone heating to ~70C , 2nd&3rd prehea

Re: High temperature solder paste for gold plated MCMs

Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui

I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic

Re: BGA voids

Electronics Forum | Tue Jan 18 12:44:24 EST 2000 | Russ

I have found that reducing the amount of metal in the joint makes a difference, we have reduced the aperture sizes to provide a minimal amount of paste. just enough to hold the part during handling. You may also want to try and slow the initial ram

tombstones

Electronics Forum | Wed Jan 12 09:30:33 EST 2000 | Jim Schultz

I need your help. I have been battleing tombstoned 0603 resistors for many months now. I have been working on the profile, the placement accuracy of the chipshooter, and the print accuracy. I am writing in the hopes that someone out there has some


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