Electronics Forum | Tue Feb 19 12:28:26 EST 2019 | slthomas
Presumably you're talking about lead free, but you don't say. Heller can probably provide you with a starting point, as rob has already pointed out, but you do need to develop the capability to perform profiling yourself. That oven should have ECD
Electronics Forum | Thu Mar 27 19:07:20 EST 2003 | jonfox
Just to be sure, you really should. PCB thickness and component density are the key players.
Electronics Forum | Fri Nov 07 18:26:05 EST 2003 | jsloot
Is anyone using .062 aluminum circuit boards with copper conductors in your production lines? What kind of reflow profile is required? What special considerations are there to be looking for? I am asking for any information you can give me. Thanks
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Fri Apr 01 03:02:59 EDT 2011 | grahamcooper22
starting point with zone settings would be, 100 / 160 / 200 / 225 / 260 deg C...but you'll have to check the exact profile on the pcb with a reflow profiler....making sure you meet the paste spec and making sure you don't heat any devices up to quic
Electronics Forum | Wed May 12 16:31:25 EDT 2004 | Mark @ SolderStar
In answer to your questions. (1) pls can any body throw some light on the reflow profiling? Reflow profiling is the process of confirming that you PCB's that pass through your reflow oven are produced within specifications provided by solder paste
Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to
Electronics Forum | Wed Jun 06 10:59:43 EDT 2001 | wbu
It�s hard to tell you one good profile for a specific machine cause profiles are mainly dependent on the specific assembly you want to rework. My aproach to this problem is trying to get a close as possible profile as under normal reflow conditions u
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
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