Electronics Forum | Fri Nov 07 18:26:05 EST 2003 | jsloot
Is anyone using .062 aluminum circuit boards with copper conductors in your production lines? What kind of reflow profile is required? What special considerations are there to be looking for? I am asking for any information you can give me. Thanks
Electronics Forum | Mon Jan 31 16:59:22 EST 2005 | frankracine
Hi Jay, Concerning you PCB, what TG do you expect to use for your lead free process? On my side I have a problem. I order PCB from Canada and from China. My PCB vendor in china is producing a lot of OSP and ENIG PCB, no HASL lead free and in Cana
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to
Electronics Forum | Wed May 12 16:31:25 EDT 2004 | Mark @ SolderStar
In answer to your questions. (1) pls can any body throw some light on the reflow profiling? Reflow profiling is the process of confirming that you PCB's that pass through your reflow oven are produced within specifications provided by solder paste
Electronics Forum | Fri Sep 22 02:19:25 EDT 2006 | lead free tester
The directive is called RoHS. Meaning that is > not only the lead that is the issue. The > materials need to whithstand a hihger > temperature, not only delta T is an issue (but > huge). Moisture sensitive devices: how to handle > these? You wil
Electronics Forum | Wed Jun 06 10:59:43 EDT 2001 | wbu
It�s hard to tell you one good profile for a specific machine cause profiles are mainly dependent on the specific assembly you want to rework. My aproach to this problem is trying to get a close as possible profile as under normal reflow conditions u
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
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