Electronics Forum | Fri Jan 16 12:03:46 EST 2009 | black5629
We are encountering similar problem as yesterdays posting, with solder not sticking to the pads but wicking to the leads on Leaded HAL finish boards, except we have tried two different solder paste lots with similar result. The oven profile and paste
Electronics Forum | Mon Feb 02 16:45:05 EST 2009 | alexander_jw
Looking for a clear conformal coating that can protect a PCB outdoors in Southern CA. Board is 24" x .25" x .03125. Require product to withstand some flexing during installation because of its very thin profile. Must hold up to environment for 10yrs+
Electronics Forum | Tue Feb 24 13:22:10 EST 2009 | pcbrookie
Hi All, Pretty new here, and to the industry and doing my best to learn what I can. Sorry if this topic has been discussed extensively, but I couldn't seem to find it via a forum search. Our company recently purchased a 7-zone reflow oven to repla
Electronics Forum | Tue Feb 24 16:39:28 EST 2009 | swag
We have to be careful with the cooling zone in our oven (especially lead-free recipes) as the cooling rate is much too high with the fan above its lowest setting. Depending on the design of your oven, it's also possible to pull a lot of heat out of
Electronics Forum | Mon Mar 02 15:38:08 EST 2009 | kpm135
I would take the board in question and run it through again with your profiler to verify that no one has messed with your oven recipe, or your oven isn't malfunctioning. Also, a before and after pic attached to the post would probably be helpful to a
Electronics Forum | Wed Mar 04 10:36:10 EST 2009 | milroy
Hi If you mean your PCB stayed in the Reflow oven more than the reflow time required for the solder paste specs then I suggest to throw away the board because it would lead over heated solder joints all over the board. Think what could happen to an
Electronics Forum | Mon Mar 09 03:45:19 EDT 2009 | nagesh
I have a double sided assembly board having more no. of QFP's & IC's at both Top & bottom.Is there any concern about this??.COz. i have the profile set to be almost same for Top & Bottom.Worried whether bottom side IC's fall/ Shift during Top side re
Electronics Forum | Fri Mar 27 14:12:10 EDT 2009 | rgduval
Check with your paste manufacturer for a recommended baseling. The paste manufacturers generally have a database by oven that gives optimal performance for their paste. It's only a baseline, and does need to be adjusted based on the thermal foot pr
Electronics Forum | Thu Apr 09 21:15:43 EDT 2009 | qualityguy
Interesting, A north American Solder resist firm stated the same thing to a degree. They said altering the resist cure profile can effectively change the surface energy thus making the surface more conducive to conformal coat adhesion. At in coming
Electronics Forum | Wed May 20 17:00:56 EDT 2009 | dyoungquist
We just placed a 56 pin QFN, 1 per board, on 10 boards and had zero defects. A good paste job, proper placement and a correct oven profile are the keys. If these are set up correctly, on larger runs your defects won't be zero but they should be le
