Electronics Forum | Tue Apr 07 05:41:34 EDT 1998 | Bob Willis
Based on work I have been doing recently the most common reasons for component loss is board flexture and vibration on the reflow process. If parts do not reflow then weight is not an issue. There is a video on double sided reflow and PIHR from the S
Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory
Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc
Electronics Forum | Fri Oct 19 01:33:30 EDT 2001 | ianchan
Hi, Encountered this deference to the vapour phase process that was supposedly "phased" out years ago? *pardon the pun* Any comments from folks who have used this proces before? how about folks who are currently using this process? even better, a
Electronics Forum | Mon Apr 01 19:57:07 EST 2002 | davef
Selective soldering machines are a good way to "finish automation", if the design of the PCB is conducive to the application with just a few components to solder. Your points are good. A decision matrix for selecting a machine might also include:
Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs
Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu Apr 10 05:25:43 EDT 2003 | dst
Hi, My company is currently experiencing a high feild failure rate on a 100nF chip ceramic that we use in various applications across our product range. One of them being de-coupling which means we use millions of this device every month. The failu
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
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