Electronics Forum | Sat Dec 26 13:41:22 EST 2009 | cobar
The negative side to tape is that you could have a small airbubble next to the T/C which will result in an inaccurate reding as the air will be hotter than the joint.
Electronics Forum | Fri Dec 11 07:30:45 EST 2009 | vei
I'm in the same situation also. You can use whatever profile in on there already, but not set your own.
Electronics Forum | Tue Jan 19 21:30:52 EST 2010 | davef
Approaches are: * Thermal profiler that you use to calibrate your oven. * Any chromel-alumel [Type K] fine wire thermocouple with a cheapo instrument attached will do the job
Electronics Forum | Thu Feb 18 22:06:55 EST 2010 | davef
Change your paste Search the fine SMTnet Archives for threads like: http://tiny.cc/LJ1rc
Electronics Forum | Mon Feb 22 16:24:52 EST 2010 | blnorman
Depends on how much voiding you have as well. 25% is allowable.
Electronics Forum | Fri Mar 05 04:19:03 EST 2010 | aungthura
Ya, that could be happened bcoz of reflow profile.I think, in this case, each lead got the different temperature during the reflow process. If the solder had melted properly,the hot lead would have attracted the solder to cover itself.
Electronics Forum | Thu Mar 04 17:56:17 EST 2010 | rmitchell
Hi, When we load a recipe (oven profile) on our heller 1809 the pc screen goes black, the oven turns off then comes back on and the error is communications with oven was lost. Anyone seen this error before? rob
Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Sat Apr 17 04:15:19 EDT 2010 | grahamcooper22
As a solder paste supplier I have profiled lots of different makes of ovens. I really like the Heller 1707. I have several customers who do lead free mid volume assembly with these ovens. They also seem to give shiny lead free joints.
Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura
Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.
