Electronics Forum | Mon Sep 06 15:43:25 EDT 1999 | jerrdog
I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". these machines dont even offer bga selections. These machines dont e
Electronics Forum | Sat Jun 12 03:51:03 EDT 2004 | Peter
Hi Mark please explain the steps which required to set up a program for cp machines
Electronics Forum | Sun Jun 06 07:29:09 EDT 2004 | peter
hi guys please tell me how to set up a program using fujicam software for cp machines, what sort of data do I need before and during programming?
Electronics Forum | Thu Jan 07 12:30:32 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Thu Jan 07 12:31:36 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Thu Jan 07 12:32:41 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Wed Sep 11 13:20:37 EDT 2002 | stepheno
I've seen this problem caused by the cool down. On a 7 zone oven I made a profile to peak at zone 5 to give some semblance of control to the cool down. The component can develope a big delta T, because of the difference of materials
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
