Electronics Forum | Thu Jul 25 01:06:43 EDT 2002 | Steven Evers
Long term storage requires the right combination of properties. ESD anti-corrosion, archival, etc. We specialize in end-of-life storage and long term preservation of electronics and micro-electronics. Feel free to contact me and check out our new web
Electronics Forum | Wed Dec 05 07:29:48 EST 2001 | PeteC
Another measurement tool is a refractometer to measure light refraction. The saponifier will have a specific refraction property is measure agianst an index.
Electronics Forum | Mon Jul 01 17:22:27 EDT 2002 | Daan Terstegge
Tg = glass transition temperature, the temperature at which the glass-epoxy starts losing it's properties as a solid material. daan
Electronics Forum | Wed Jun 26 17:52:36 EDT 2002 | davef
Search the fine SMTnet Archive for: The Effect Of Metallic Impurities On The Wetting Properties Of Solder by: Dennis Bernier Vice President, Research & Development Kester Solder Company [ http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread
Electronics Forum | Tue Jan 28 17:23:11 EST 2003 | C. M. Gabel
I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?
Electronics Forum | Sun Feb 02 10:00:55 EST 2003 | davef
Mitsubishi Gas & Chemical's Bismaleimide-Triazine (BT) resin laminates are the defacto standard material for BGA. Have you checked with them?
Electronics Forum | Mon Jun 07 09:29:17 EDT 2004 | Rob
Depends on the manufacturer but I know with Kester they strictly tell you once paste dries out it can never be brought back to usefulness. Adding flux will alter the properties of the paste and may affect the final product.
Electronics Forum | Sun Aug 01 11:31:59 EDT 2004 | Andrew
How do you define torque setting for screw?What does 1)Screw with Bolt size 3-48 means ? 2)Thread Size M3 means? 3)Fasterner Property Class?
Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.
Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat
Electronics Forum | Fri Dec 16 10:25:37 EST 2005 | solderiron
Rather than cleaning a water soluble flux residue off the board, by encapsulating the product. covering the board or the component with lets say a Hysol encasulant. Would this prevent the active flux residue from migrating and deteriorating the elect