Electronics Forum | Wed Jun 24 15:16:51 EDT 2020 | SMTA-Dave
The typical CTE below Tg is 40 ppm/K and 110 above Tg ppm/K. The typical modulus is 16 Gpa
Electronics Forum | Tue Sep 07 21:15:20 EDT 2021 | dwl
This should be possible, but definitely get the OK from your customer first! Layer thickness may effect things like impedance, EMC, or other electrical properties of the assembly. out of curiosity, why do you want thicker boards?
Electronics Forum | Mon Sep 27 09:24:33 EDT 2021 | dianau
Hello all, Does anyone here knows if it exist a special solder paste for diode laser soldering? What are the property that should have? Currently we are using a lead free solder with 2.5% flux. Thank you!
Electronics Forum | Wed May 22 11:04:40 EDT 2024 | wippsen
The setting has to be done on the machine where u want to connect. not in the vnc viewer settings. look at the machine down right in the windows task, rightclick on vnc app and change admin properties settings.
Electronics Forum | Mon Aug 02 09:26:15 EDT 2004 | davef
Q1: How do you define torque setting for screw? A1: Talk to people at your nut supplier. Some nut suppliers post torque tables on the web. For instance: http://www.thelenchannel.com/1torque.html http://www.marfas.com/Ttorque.shtml http://www.pac
Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F
It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
Electronics Forum | Mon Jan 28 16:12:47 EST 2002 | Joe B.
Dave F, thank you for your reply and the references you included. You asked why I'm trying to understand this info, here's an answer: I'm working on an NSF-funded materials-related project, one aspect of which may lead to some advances in the forma
