Electronics Forum | Thu Sep 08 13:40:39 EDT 2005 | rcegan
Can someone please Help me. I just recived a request from my CM asking for informtion for Kodak Q-1003 specs, apperantly ther's a file in the gerber files for PS08799 Rev D � 4 layer board that refers to this spec.
Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook
| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads
Electronics Forum | Fri Jun 18 11:37:10 EDT 1999 | Earl Moon
| | | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pa
Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo
Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Wed Apr 18 08:57:45 EDT 2018 | davef
Here is the IPC Standards Tree [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf ]. The design standards that you ask about are over on the right side. I'd guess that the following standards would be a good starting point: * IPC-2221, "
Electronics Forum | Wed Aug 22 19:54:54 EDT 2001 | mkallen
Can anyone point me to a relevant IPC spec that specifies an allowable board stretch, measured between metal features on outer layers (e.g., between fiducials and component pads on the topside of a board)? I've got a non-linear stretch problem that'
Electronics Forum | Wed May 30 17:49:49 EDT 2001 | davef
You are correct. IPC wants you to pay for that standard, regardless if you get a hard copy or download it. Generally, it�s pretty boring stuff for production types. [Although, you will recognize some of the goofy things your designers have done to
Electronics Forum | Tue May 18 09:13:08 EDT 2004 | E Wolf
I'd like to follow the thread discussed on assembly. Hope Everyone is ok with that. I do run into the problem (have it now) that Ionic cleanliness is requested by print on a no-clean assembly. My intention is to use the no-clean to skip the aqueou
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