Electronics Forum | Wed Mar 10 12:02:07 EST 1999 | Craig Holloway
Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. Need a way to get good thermal contact between par
Electronics Forum | Thu Mar 11 11:58:18 EST 1999 | P.L. Sorenson - Technical Consultant
| Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. | | Need a way to get good thermal contact betwe
Electronics Forum | Thu Feb 05 05:27:55 EST 2004 | dszeto
We have recent customer asking for PCB's PTH hole size related to soldered wire AWG 18-26. Please kindly advise any international standard for captioned issue. Thanks!
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Sun Aug 26 07:13:05 EDT 2007 | callckq
Hi Experts, Understand from my friends, PTH crystal can get damage easily when subject to vibration or heat..For example, if crystal drop from table to floor, its internal part already damage @ crack which cannot be seen by eye. Besides, they als
Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Wed Jan 28 08:56:40 EST 2009 | blnorman
Don't know the specifics from the IPC spec. However our standard internal spec dictates - highest thermal mass, lowest thermal, most critical component, and center of PCB on the laminate surface. Our profilers have 6 inputs, so the other 2 are dete
Electronics Forum | Thu Nov 08 22:27:52 EST 2007 | jkhiew
Did the PTH barrel ends in massive copper clad ? If yes this type of poor thermal layout topside heating is often recommended.
Electronics Forum | Fri Jan 22 08:25:18 EST 2010 | davef
This socket supplier never expected you to do what you're doing to his/her part. Some materials bear-up under the thermal strain of reflow solder than others. Try different socket materials.
