Electronics Forum | Fri Jan 29 10:09:27 EST 1999 | Robert Cass
Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted.
Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach
| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Thu Jan 13 17:46:04 EST 2011 | davef
We've never seen the defect that you describe, but in wave soldering-land blowholes usually are caused by moisture in the board that out-gasses through the too thin plating of through holes. * Bandaid fix: bake the boards * Long-term fix: Obtain boar
Electronics Forum | Mon Apr 27 02:44:07 EDT 2009 | michafogel
Can someone point me to a standard, if there is any, or design rule regards with preffared spacing between PTH and SMT pads for LF wave soldering process (SAC alloy)
Electronics Forum | Thu Apr 30 06:14:26 EDT 2009 | michafogel
Thanks , I'll try it too.
Electronics Forum | Fri May 01 06:49:31 EDT 2009 | davef
minimum space between selective wave soldering pallet's opening to the nearest PTH or SMT pad? * http://www.agicorp.com/pdf_files/Designguidelines903.pdf * http://www.datumdynamics.com/resources/dfm_wavesolder.html?PHPSESSID=a73b3bc8bbd55519bffbb68
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu Feb 17 10:14:40 EST 2000 | Jim N
We bulid many boards with fine pitch on solder side and then wave. We use a wave fixture that is custom for each board. The fixture covers the SMT components and only exposes the PTH lead during the wave process. It requires about .070 to .100" clear
Electronics Forum | Fri Jun 21 02:11:27 EDT 2019 | alanyang
Many aspects cause such problem, stencil windows and thickness, thermal pad and crowded PTH vias on PCB, the castellated pad size and pcb pad size. Do you have picture for reference?
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