Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia
Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.
Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose
Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Fri Aug 27 12:56:27 EDT 2004 | cyber_wolf
Can anyone tell me where I can find a pull tester/guage for the overlay on tape and reel? Thnx
Electronics Forum | Fri Aug 27 14:28:57 EDT 2004 | pjc
http://www.vtekusa.com/products.htm
Electronics Forum | Fri Aug 27 14:59:02 EDT 2004 | anonymous
GPD,General Production Devices has a T&R Peelback Force Tester among their product offerings. 1-800-pickgpd I am not aware of other vendors offerings.
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
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