Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia
Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Wed Nov 26 09:16:59 EST 2008 | barryg
Hello everyone, after a short layoff I am glad to be back. I have a question. I have a button (snap button) that is being soldered to a strip of sac coated copper. We are questioning the joint strength of this from our vendor as we see these popping
Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc
From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some
Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs
you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
