Electronics Forum | Fri Jan 15 17:13:07 EST 1999 | Earl Moon
| | | | Hello, | | | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | | | So far, the tests I can think of
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike
We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Wed May 04 10:27:33 EDT 2005 | nice90
Or you can use the Hot Air (Hakko) to remove that component and a tweezer to pull it. dont pull it just yet. If you see the solder melting then feel the component using the tweezer by wiggling it a bit and if you can wiggle it only then you can pull
Electronics Forum | Wed May 04 12:11:58 EDT 2005 | thaqalain
Thanks Nice , u r really at right angle 90 deg.I tried desoldering by both guns, then tried to pull it out but no success. In what units u talking about air and temperature?
Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef
There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25
Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs
you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a
