Electronics Forum: pull test after soldering (Page 8 of 78)

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik

| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Wed Aug 24 22:11:36 EDT 2016 | davef

I'd guess that "black pad" is not the issue that you need to address, because only 2 of your 5 test points has the problem that we seem to be discussing. I'd expect "black pad" problems to be more wide spread. Something is going on at those two locat

Re: Visual Inspection after SMD Placement and After Wave Solder

Electronics Forum | Fri Jul 16 05:24:40 EDT 1999 | Chris May

| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 22:36:24 EDT 2005 | Ken

1. How did your customers preious supplier deal with this problem? 2. Why did they not alert you these sepcial needs during the quoting process? If they have special needs then relegate the parts to hand-stuff. Don't forget to adjust your price

Problems with diode during wave soldering

Electronics Forum | Tue Sep 18 21:37:06 EDT 2012 | vergara1

Hi Manoel, I want to make sure I understand what you are talking about; reading the reply,along with your replys it almost sounds as if we are not talking about the same thing. In your picture I'm seeing a SMT diode correct? You are talking about th

ROSE testing for no-clean flux soldering assemblies

Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous

ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l

Re: soldering to hard gold plated PCBs

Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.

| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect

Wave soldering - black residue / bridging

Electronics Forum | Fri Dec 27 02:11:31 EST 2019 | anteiv

Hello, We are having problems with SMD wave soldering (ERSA) used flux is BALVER ZINN 390-RX-HT https://www.balverzinn.com/tl_files/balverzinn/downloads/intern/TDB/PDS_390-RX-HT_EN.pdf https://www.balverzinn.com/tl_files/balverzinn/downloads/datenb

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir

Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent


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