Electronics Forum: pull test bga .020 (Page 1 of 5)

BGA Pull test

Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike

I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

BGA Pull test

Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.

When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing

BGA Pull test

Electronics Forum | Tue Oct 26 17:01:08 EDT 2004 | Mike

Hi Guy's thank you for the Info, This is a New Assembly house that our OEM has Moved to and they have not been very open in discussing this issue other than they are telling us this is board related. I have ask for samples of faild product with th

BGA's ramp up rate in a convection oven

Electronics Forum | Tue Dec 28 10:04:01 EST 2004 | Mark

No delta T issues as I am not actually reflowing the component to the PCB. This is for moisture sensitivity testing as per JEDEC 020C Standard. Trying to duplicate a profile in the standard and am having trouble reaching a component ramp rate of 3

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 09:47:45 EST 1999 | Justin Medernach

| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | Hi Al, A BGA should be looked at just like any other surface mount device. However, just

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 17:51:45 EST 1999 | gcollier

| | Hi everybody. | | Somebody know any consideration or special care to make a profile for BGA's. | | | | any advice is aprecied. | | | | thanks | | Al Carrillo | | | | | Hi Al, | A BGA should be looked at just like any other surface mount d

Sheer strength of a BGA assembly

Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef

There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25

Re: BGA Shorting problem

Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or

| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce

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