Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Fri Feb 17 12:53:30 EST 2006 | bvdb
We just got our used Fuji IP-1 working well. Sometimes during testing of a new program/pcb we like to stop the run and re-start with a clean board. When we make the IP-1 eject the unfinished pcb and start with a new pcb the IP-1 does not scan the f
Electronics Forum | Sun Jun 25 08:51:02 EDT 2006 | cloggy
Problems like these are not caused by bad feeder quality. As described in the solution finding, the pull off forces of the cover tape are just too high. Cause is the blistertape and not the a feeder. Have you ever tested if the pull of force of the
Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman
Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul
Electronics Forum | Mon Oct 08 02:12:21 EDT 2001 | george
I do not doubt about the power of the 552 and 580, but in some cases it may be overdone. For just a simple (straight forward) shear test, you can also look at: http://www.chatillon.com/products/dpp.html (�Low Capacity Mechanical Force Gauge. These er
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Tue Jul 31 15:29:45 EDT 2001 | hinerman
Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider th
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
