Electronics Forum | Thu Dec 06 02:45:09 EST 2007 | mun4o
hi, we use pump print stencil and have problem with cleaning.we clean the stencil handling, using zestron301, but in the holes stay adhesive.Take a test with ultrasonic cleaner but resalt is not good.
Electronics Forum | Thu Dec 06 08:57:32 EST 2007 | davef
With this small amount of background information on the situation, comments are: * If you let adhesive cure on your stencil, you should not be using Zestron 301. A hammer and chisel is more effective. * Assuming you are not letting the adhesive cure,
Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc
Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI
Electronics Forum | Fri May 23 04:25:14 EDT 2008 | muarty
One thing that has to be considered when using rheometric pumps is that the board support should match as that of the pump head being used. You can print 6" boards, but you should really still use board supports upto 16". As mentioned previously if t
Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Mon Oct 17 11:16:09 EDT 2005 | slthomas
There are a lot of things that might affect your cleaning efficiency. Paste type (no clean or w/s?), cleaning chemistry, aperture aspect ratio (aperture width/stencil thickness), "linty" wipes, etc. Another thing you need to look at is the frequency
Electronics Forum | Tue Oct 11 10:49:14 EDT 2005 | jhagve
HI We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Wed Aug 16 13:31:30 EDT 2006 | a_laser
You can stop cleaning after a job when there is no more paste in the apertures. Under wiping should be done with a quality cloth and should leave no paste on the underside of the stencil (assures good contact on the next print and reduces chances of
Electronics Forum | Thu Jun 15 09:58:12 EDT 2006 | slthomas
Just to add to what dave said, the only limitation to how frequently you clean is the cost of the cleaning medium. You can wipe every board if you want to, but you'll go through material accordingly. If you're printing 16mil pitch or smaller, cleani
