Electronics Forum | Thu Mar 29 20:39:01 EST 2001 | huat
Hi, Now, I'm working on depanalising equipment. The operating concept of this equipment is punch on the board for depanalising panel boards using Die-set. Now, I'm trying to determince the punch force using some formula, which I can't fin
Electronics Forum | Thu Jul 25 14:05:12 EDT 2002 | Bordiky
I've been reading the forum here for a few weeks and found some helpful material from talented individuals. Now, I have a question(s). I'm looking into different alternatives for doing X outs. Right now I'm familiar w/ two of them:1. Bad Board Mar
Electronics Forum | Wed Jan 22 11:05:25 EST 2020 | dwl
Routing is great for odd shaped PCBs that don't lend themselves to v-scoring. changing from one shape PCB to another is easy. The down sides are you may require custom support tooling and they generate alot of dust. keeping up with the PM will be cri
Electronics Forum | Tue Nov 16 09:44:18 EST 1999 | - bobar
Ken, The technology you are referring to is also known as return-to-web. This panelization method involves a hard tooled perimeter die and a press equipped with an air cushion. The PCB circuit is punched out and then inserted or "pushed" back into
Electronics Forum | Sat Dec 09 08:32:25 EST 2006 | davef
Thoughts are: * Most board fabs have routers that can do this work. Can yours rework these boards? * Scrap the boards and start anew. Someone made a mistake. Cut your losses. * As a wild and crazy guy alternative, buy a router with a 45* bit from
Electronics Forum | Tue May 22 10:33:36 EDT 2012 | swag
In my opinion, the best solution is h-towers or similar dedicated tooling designed for each build. However, a quick cheap fix is to make templates to lay in the bottom of the centernest. If you have access to CAD software, you can print out the ger
Electronics Forum | Fri Jun 18 11:37:10 EDT 1999 | Earl Moon
| | | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pa
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