Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Fri Aug 11 14:48:00 EDT 2006 | flipit
Hi, I live in Minneapolis,MN USA. I was watching the news last night and began to laugh. There was a news story on the benefits of silver in fighting infection and healing. I know first hand that silver fights bacteria. I set myself on fire worki
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Mon Dec 04 11:46:41 EST 2006 | samir
SMTNetters, I have a product coming down the pipeline that we'd like to make pure double sided reflow, it'll be RoHS product, and the hope is... we'll be able to solder the thru-hole stuff by screen printing solder paste and reflow soldering. Anybo
Electronics Forum | Mon Apr 16 11:58:07 EDT 2007 | cingsman
I believe SAC305 will result in a lesser amount of Ag3Sn inter-metallic compounds being formed along the joint boundary and in the sphere. Studies have been shown to point out a significant difference between the number and size of Ag3Sn plates in SA
Electronics Forum | Tue Feb 19 12:41:20 EST 2008 | patrickbruneel
Yes dendrites can cause electrical shorts. The first stage of dendritic growth is a dark fern like pattern which reduce surface insulation between anode and cathode. In a more advanced stage the ferns transfer the plating metals of the conductors and
Electronics Forum | Thu Mar 13 15:17:03 EDT 2008 | slthomas
about WHY violating IPC design standards gives you grief? Do they even know they exist? We've got one in particular that seems to shoot from the hip. I want to tell them the "why" as well as the "what" so they'll be a little more proactive. My fee
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Wed Jul 09 18:36:08 EDT 2008 | jmelson
Just to clarify, I tried to read a summary of the Oko institute report, but it was in some word processor format I wasn't quite compatible with. But, I did get some of it. It appeared to restrict ANY use of nickel (couldn't tell if that was in allo
Electronics Forum | Fri Sep 12 04:21:54 EDT 2008 | gsala
Had same problem with SOT23 (two different PNs and Suplliers) problem was random (AVG 0,15%). Parts are RoHS but soldered by SnPb, Lead frame Plating (e3)according to IPC-J-STD609 it means Sn pure (check the label on reel), additional info, it is S
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