Electronics Forum: push testing (Page 1 of 15)

Epoxy Push Test Specifications

Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell

Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell

Epoxy Push Test Specifications

Electronics Forum | Wed May 29 10:14:04 EDT 2002 | Hussman69

You mean the destructive test were you continually push on a part until it breaks free from the board and flies across the room?

glue measurement

Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua

Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &

Epoxy Push Test Specifications

Electronics Forum | Wed May 29 21:56:47 EDT 2002 | davef

We have talked about testing the cure of glue, epoxy holding secondary side compomponents in place prior to wave soldering several times here on SMTnet. Search the fine SMTnet Archives, if that's what you're seeking.

Push&Pull Test of Fine Pitch Components

Electronics Forum | Fri Sep 19 14:11:39 EDT 2003 | Bryan Sheh

Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or

Epoxy Push Test Specifications

Electronics Forum | Thu May 30 11:19:29 EDT 2002 | Hussman69

Ooops, my bad. "Curse your eyes Nell, for even asking a question on this forum. Check the archives before we put a curse on your adhesive process and force you to ask another question!" Whew, hope that made up for my mistake.

Epoxy Push Test Specifications

Electronics Forum | Thu May 30 14:11:24 EDT 2002 | Hussman69

Sorry Nutty. But then again, this coming from a guy who used to answer in Ebonics, makes me wonder why.

Solder joint strength

Electronics Forum | Mon Mar 28 14:57:46 EST 2005 | chon

So far I've been working with a xtal. I've been placing this on a board and the part was falling from the board. We found residues on leads and notified vendor as contamination, after that 100% of our production has been verified with a perpendicular

Epoxy Push Test Specifications

Electronics Forum | Thu May 30 14:07:22 EDT 2002 | davef

Slappy The level of rightous indignation is well done, but sarcasm seems a bit overdone. Just a twinge of it would have been fine. Needs some work. Good shot at it though. Yano, maybe the 'cursing of eyes' bit was a little over the top also. Po

Push&Pull Test of Fine Pitch Components

Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt

Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds

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