Electronics Forum | Thu Jan 30 07:27:00 EST 2003 | cnotebaert
As said earlier the best way is to cure it then discard. Is your material heat cure or moisture cure? If heat cured and you ahve a oven place the material in trays and heat cure and discard. If moisture cure leave the material in the container and ad
Electronics Forum | Fri Jan 16 06:53:33 EST 2009 | stevewilde
I am using Humiseal 1B31 conformal coating and xylene mix on a PVA coating machine. Bubbles are appearing between the pins of LCCs mainly and bubbling is worse when put through the IR oven. Does anyone have any suggestions or tips to elliminate this
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ
Electronics Forum | Tue Feb 03 13:39:08 EST 2009 | grics
Good morning Jamie. I work at a CM and can offer some input on process flexability. I do not have any data on how reliable the coating is but I can say that they are both very difficult to control. Will you be selective coating or full coating? Ho
Electronics Forum | Tue Nov 16 19:53:24 EST 1999 | Chris
Does anyone know sources for vertical cure ovens. I remember seeing several add years ago but appears the subject has lessened. I know Heller makes a couple of them. I remember Blue M making one too. All I find now is Heller. Also what other adv
Electronics Forum | Fri Jul 07 10:59:15 EDT 2017 | capse
I looked at the tech data for the coating. It appears to need an explosion proof oven for curing (flammable vapors from solvent). I doubt the Heller reflow is explosion proof type oven.
Electronics Forum | Fri Jun 16 00:58:36 EDT 2000 | DL
Does the manufacturer of your glue suggest a curing temp? If so and if ya dare..seems to me you do, you could use an oven something like a bakers oven. We use HI Temp ovens to cure epox, glue and stuff like that. Sounds to me like it's time for a new
Electronics Forum | Thu May 28 03:18:22 EDT 2009 | cunningham
We use an epoxy method at the moment but the cure times are long with 4 hours oven cure and 4 hours air cure before solder can be applied to the pad the hot press bonds the already made epoxy pad to the board in less than 5 min and is ready to solde
Electronics Forum | Wed Dec 09 08:45:31 EST 2009 | orlando
Does anybody run conformal coating process using UV cure varnish? We have a long experience on solvented urethane coating material but switching to solventless is unknown for us. Could you recommand vendors for UV curing oven? Thanks
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
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