Electronics Forum | Tue Feb 03 13:47:59 EST 2009 | grics
I would also suggest looking at your ramp rate in the cure oven. We noticed that accelerated heating increased the "gas out" of the solvent. We run 1A33 and and do not exceed a .5/degC ramp rate.
Electronics Forum | Sun Nov 22 19:53:10 EST 2009 | prodrivegsr
Hi Ju Yong, The PCB are dry in an airseal cabinet(Staging Chamber) before IR Oven. The bubbles show at around body and solder joint area. You mean the moisture will create bubbles ? Able to advice the humidity and temperature that you are using in
Electronics Forum | Mon Oct 05 01:20:46 EDT 2020 | SMTA-64386317
No pre heat the board and only apply at 2 sided of component. Yes, there is bleeding but as long did not covered nearby component is acceptable. We are using UV oven for curing.
Electronics Forum | Tue Mar 27 02:57:32 EST 2001 | Ken S.
Have you a reflow oven that has upper and lower heaters? Have you a reflow oven that uses hot air as well as elements to control the transfer of heat to various areas? If yes to these, I would suggest increased air flow or change in direction of
Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514
right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec
Electronics Forum | Thu Jun 05 07:54:20 EDT 2008 | davef
You're correct, uV costs 1.7X solvent-based silicone. This high purchased material cost is counter balanced by uV requiring lower thickness due to higher solids and that 60 to 80% of a solvent coating is volitile and goes up the pipe between applicat
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon
| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr
