Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef
Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Fri Aug 10 07:33:32 EDT 2007 | davef
Tran Since we all agree that J-001 has no baking requirement, why are you baking the boards? What is the purpose of this bake process?
Electronics Forum | Mon Nov 08 11:11:16 EST 1999 | John Thorup
Believe it! Although it might be necessary in certain rare cases, and as Ray says, as a bandaid, to routinely bake your boards is a mistake. For much more info, search the IPC technet archives over the last few weeks. It was a popular thread
Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca
Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca
Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran
Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran
Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran
DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48
Electronics Forum | Wed May 19 15:32:55 EDT 1999 | Ron Beasley
Can anyone help me with the correct baking cycle for removing moisture for PWB's. These are 10 layer double sided SMT. Thank You
