Electronics Forum | Thu Jul 18 12:20:09 EDT 2002 | pjc
Reject the batch of boards. Take one board, dry it, then check for solderability. If its good, do the rest. If not.....? Contact the PWB vendor for reccomendations.
Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016
After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Sat Sep 13 09:36:53 EDT 2008 | davef
Lemme tell ya, those are weird looking pix. If OSP boards have not been dried properly prior to bagging and sealing, water can leak from via and ruin the OSP, which will turn black.
Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton
Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m
Electronics Forum | Tue Mar 20 02:22:22 EST 2001 | PeteC
Can anybody advise on repairing PWB edge gold contact fingers that get solder on them?
Electronics Forum | Thu Apr 17 14:01:26 EDT 2014 | hegemon
And digging a bit further, are the opens at the device level (all the solder on PWB pad, none on device pad) or at the PWB (similar to pillow defect?) After answering that, I would start thinking about(in this order)paste print quality and consisten
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
