Electronics Forum | Sat Mar 24 05:25:07 EDT 2007 | mika
Thanks aj, Ohh I wish that there was a way to post a picture in this forum or a possibility to attach the datasheet... Which BTW does not have any recommendation of "how to". This package does not have the "center thermal pad" like a QFN or MLF pack
Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
Electronics Forum | Sat Mar 24 12:15:31 EDT 2007 | aj
I was referencing a qfn type package - apologies for any confusions. I have no experience with the package you are refering too. I would be interested to see how you get on. I will have a look at the datasheet if I can find it. Later, aj...
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Wed Jul 30 23:40:45 EDT 2014 | matusov
Yes, but I have seen designs where the whole row > of leads has no mask(which is also a NSMD) Apparently I might have to do just that for some parts. We have a few parts with 0.2 mm pads at 0.35 mm pitch. Our PCB shop says that they need at least
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Thu Jun 23 11:56:51 EDT 2005 | wjxingggg
Hi, all. There is one 0.8mmX0.8mm QFN on almost of our PWBAs. But the quality report showed that we got bad solder quality for this component. My question is which elements are the root cause for this situation frequently? Thanks.
