Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice
Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl
Electronics Forum | Mon Sep 23 01:28:13 EDT 2019 | sssamw
Cannot understood your problem very clearly, please check IPC standard on QFN and its mfg process, also check the QFN supplier's recommendation, so can minimize the bridge.
Electronics Forum | Mon Nov 13 09:40:01 EST 2017 | philc
Just a few thoughts, as we use similar quite frequently without issues. Ensure correct support when pasting the board, especially if it is thin. Correct support when placing the part. Is it placed correctly by the machine? If it is very slightly of
Electronics Forum | Thu Feb 11 06:50:17 EST 2010 | CL
Good Morning Bryan, We are using Mirtec MV-3 AOI's with 4 megapixle cameras. We use them for 100% post reflow. We are checking, presence, polarity, value, solder, bridging,component height for BGA, QFN etc... and 1st piece validation for machine set
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Thu Oct 15 11:04:28 EDT 2009 | spitkis2
Thanks Jim. Pressing the QFN into paste was what I thought of, just wasn't sure if it would cause solder paste to be pressed outside the pad area and possibly bridge with an adjacent pad. Do you recall the ratio of paste coverage to the pad area?
Electronics Forum | Fri Feb 08 16:21:15 EST 2013 | spitkis2
Are you doing this to minimize solder paste splattering? Is this a value that you use for all QFN's (would the overall size of a QFN matter)? I was told reducing placement force with these components is recommended so just was wondering what is bein
Electronics Forum | Fri Nov 10 22:31:27 EST 2017 | myke03o
Hi, we are experiencing insufficient solder and bridging solder. Any recommendation on the inner pad (LGA) and stencil thickness. Any suggestion will be very helpful. link: http://www.latticesemi.com/~/media/LatticeSemi/Documents/ApplicationNotes/
Electronics Forum | Tue Jun 03 01:03:04 EDT 2008 | daxman
Hi, I think what you are describing is a half-etch QFN, which causes the 3 mil gap. In our process, we don't require solder to bridge this gap as it's internally connected to the bottom lead. I'm not sure if this is the question you're asking, but
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
