Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar
Flason SMT News: http://www.flason-smt.com/new/6-Things-to-Check-Before-Submitting-Your-PCB-Design-for-Manufacturing.html http://www.flason-smt.com/new/about-wave-soldering-machine-tin-pot.html http://www.flason-smt.com/new/Advantages-of-Design-for-
