Electronics Forum | Thu Nov 15 09:29:03 EST 2007 | jaimebc
Just to add to the subject, we experienced insufficient solder on our QFN's at our prototype level. To correct it, we went to a 5 mil stencil, 20% reduction on QFN pertures and used QFN's with solder bumps on the pads. We had great results using thi
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Mon Jul 13 05:54:39 EDT 2009 | rway
Hello all, We are looking to purchase another AOI system with side angle cameras. Currently we are using a YesTech M1 system that has only a top-down camera (it can't be upgraded with side cameras). Does anyone have experience with YesTech F1 sys
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Fri Nov 10 22:31:27 EST 2017 | myke03o
Hi, we are experiencing insufficient solder and bridging solder. Any recommendation on the inner pad (LGA) and stencil thickness. Any suggestion will be very helpful. link: http://www.latticesemi.com/~/media/LatticeSemi/Documents/ApplicationNotes/
Electronics Forum | Wed Jan 17 10:14:37 EST 2007 | slthomas
2-3mm would seem close enough to affect the air flow and I was thinking it could be displacing the qfn. However, if you ran a failed board back through reflow and it was functional after that, I'd put my money on insufficient reflow. I suppose it's
Electronics Forum | Tue Feb 11 11:40:21 EST 2020 | emeto
Sebas, on your profile you have listed U2, U101, U102 and I was wondering if the questioned part is one of them. I attach a typical profile specs - you should follow the one for your paste. In the one you attached the slope is too fast, soak is prob
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