Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Thu Jul 05 13:47:10 EDT 2007 | arun2382
QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a second time, it recovers and passes testing. Visual, X-ray inspection revealed no anomalies. Cross-section images of solder joint revealed no anomalies (
Electronics Forum | Thu Jul 05 17:10:29 EDT 2007 | arun2382
Thanks all! I'm facing this issue with one specific batch of QFNs. It could be a plating issue. But, nothing was evident from visual inspection,No sign of voiding or non-wetting. Cross-section images of solder joints were clean as well. Could this s
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar
Flason SMT News: http://www.flason-smt.com/new/6-Things-to-Check-Before-Submitting-Your-PCB-Design-for-Manufacturing.html http://www.flason-smt.com/new/about-wave-soldering-machine-tin-pot.html http://www.flason-smt.com/new/Advantages-of-Design-for-
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