Electronics Forum | Wed Feb 12 07:25:47 EST 2020 | dontfeedphils
If you have control of the solder alloy you're able to use on the product, you could run a lower temp solder on the second side and try to avoid the first side entering reflow.
Electronics Forum | Wed Feb 12 08:10:49 EST 2020 | majdi4
We can't do that because we are using dual ligne reflow oven..So the two sides of PCB are soldered with the same reflow profil.
Electronics Forum | Fri Feb 14 12:22:57 EST 2020 | etmpalletguy
OK, you can't glue, Pallet Guys pallets are out the door, dual line reflow prevents from any lower temp solder paste.... Do you have a 3D printer? Are there parts underneath the connector in question? Measure the PCB thickness, pint out a custom hold
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov
Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w
Electronics Forum | Thu May 05 08:14:45 EDT 2011 | kahrpr
Where black pad exists, it is not a common problem. When I read it is totally random I doubt that. You have defiantly something going on that is unique with the process. It is either your board manufacturer or your solder paste or your profile. It c
Electronics Forum | Thu Oct 05 16:12:09 EDT 2006 | Mario Scalzo, SMT CPE
* Try 1.5C / sec from RT to 165C * Hot soak at 165-175C for up to 2 minutes (I'd start with 60 seconds flat soak.) * 60-90 seconds TAL (I's start with 60) * 230-240C Peak. Thanks, Mario
Electronics Forum | Wed Oct 04 14:18:05 EDT 2006 | C.K. the Flip
The main cause of voids is your flux out-gassing during reflow. Try a little "knee" or slight soak in your thermal profile to dry out the volatiles a bit. Typical soak ranges from 130 deg. C to 170 deg. C for around 30-90 seconds.
Electronics Forum | Fri Oct 06 15:43:33 EDT 2006 | Mario Scalzo, SMT CPE
What I usually do is keep the peak temperature about 5-10 deg C below the peak temperature of my lowest rated component, then set everything else up around that. Worse case scenario is to just extend the time above liquidus (TAL) in 5 second increme
Electronics Forum | Wed Oct 04 15:06:57 EDT 2006 | C.K. the Flip
Hmmm.. you are in a pickle then. I have AIM's "Reflow Profile Supplement" where they recommend a Low-Long-Soak (LSS) profile for situations like your's. It's an old-school type profiling approach where you ramp up to 120*C for about 1 min. then soa
