Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason
Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???
Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ
We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran
Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Wed Feb 19 19:24:12 EST 2003 | arturoflores
Is there any way I can attach a report?
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